I'm simulating the thermo-electro-mechanical behavior of a copper wire which is surrounded by silicon dioxide. In other words, the wire segments is under mechanical and thermal loads and at the same time an electrical current is flowing in it.
In order to perform the simulation accurately, I think that I should consider an initial stress due to the mismatch of thermal expansion coefficients between copper and oxide. I am using COMSOL to do my simulation. The options that COMSOL provides me with are "body load" and "boundary load". Can anyone advise me which one I should choose? Which one is a more realistic assumption. Thanks.