Total newbie here way over my head on a project I'm working on. I need to protect some electronics while they are inside an injection mould of liquid latex that measures 180 degrees celsius. The electronics are 'baked' for lack of a better word for 16 minutes, then dropped into cold water out of the mould to cool. I need to make sure I don't melt/destroy the electronics by keeping them below 60 degrees celsius during this step.
My plan is to use a silicone potting compound which measures at 0.06 watt/meter/K. I'm trying to calculate how thick the layer of silicon needs to be between the electronics and the heated latex and what the temperature will reach per minute the ball is exposed to this heat so I don't need to destroy prototype electronics doing trial and error.
Any help would be amazing! In summary:
- 180 degrees Celsius for 16 minutes
- electronics measure 12mm in diameter (sphere)
- Silicone thermal conductivity of 0.06 watt/meter/K
What thickness is required to make sure the electronics don't get above 60 degrees celsius?
Update - I found the specific heat value on the spec sheet of 1200 J/kg.K